From: DigiTimes
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COMMENT: Many legitimate companies have business relations with war contractors, who by definition are guilty of crimes against humanity. The sponsored content below illustrates how war contractors and multinational corporations, insinuate themselves into business with those who are unaware of their values and ethics.
Increasing the understanding of the strategies carried out by drone contractors, and other merchants of death, will begin.
Sponsored content [Friday 29 March 2013]
American Micro Devices (AMD) has launched a full range of
OpenCL-compatible heterogeneous parallel processing products, including
traditional x86 CPU, GPU and integrated APU chips, as well as embedded
GPU chips/MXM modules and add-on cards, etc.
Not only
has AMD won acclaim with its AMD Turbo CORE, AMD Eyefinity, and AMD Dual
Graphics technologies, AMD is also committed to establishing a
comprehensive heterogeneous multi-core industrial alliance and ecosystem
with the midstream and downstream hardware and software industry
sectors to bring embedded systems into the new realm of heterogeneous
parallel processing.
Careful observation of the embedded market and continued R&D investments
Arun
Iyengar, corporate vice president and general manager of the AMD
Embedded Solutions Group, indicated that the scope of applications for
the embedded market is very broad. The sales cycle for the entire
product line is considerably longer than in other markets. During the
early stages of the cycle, suppliers would have 3 months to send samples
and selections to customers. After the design is adopted (design win)
the SI certification stage is approximately 12 to 18 months. Finally,
moving a product from engineering prototype to mass production for the
customers would stretch for another 36 to 60 months. This entire process
could take up to a decade for defense military institutions.
The
embedded market is more focused on the optimal heat dissipation rate by
adopting low power consumption, no cooling fan, higher functionality
integration, and more compact designs to create the smallest sized
products with optimal energy efficiency in order to lower the total cost
of ownership (TCO). The customers hope suppliers can fully understand
its product strengths and weaknesses, provide solutions, and tailor the
various solutions to respond to the specific needs of the market.
Iyengar
indicated that AMD is carefully observing the development of the entire
embedded market and continues to invest in its R&D. Since June of
2012, AMD's Embedded Solutions Division has been organized into an
independent group. In October of 2012, CEO Rory Read indicated that the
embedded market has become the group's rapid-growing emerging business;
and 2013 is regarded as the first year for AMD embedded solutions.
AMD, a pioneer in the embedded market for many years
Iyengar
stressed that AMD has been a pioneer in the embedded market for
numerous years. From the Am386 and Am486 processors in 1991, the Am5x86
in 1995; the Elan SC520 in 1999; the acquisition of Alchemy
Semiconductor and National Semiconductor (NS) by the AMD Geode processor
business group between 2002 and 2003; the addition of the 64-bit AMD
Opteron, AMD Athlon, AMD Turion, and Mobile AMD Sempron processors into
the embedded market; and the ATI Radeon E2400 GPU launched in 2008, and
only reached EOL this July. In 2009, AMD launched the ATI Radeon E4690
GPU with 2D and 3D multimedia graphics performance and multi-screen
output capacity that is suitable for a wide variety of embedded
applications in gaming consoles, consumer electronic products, digital
billboards, and industrial control boards, as well as for applications
in the medical, defense, and aerospace fields. AMD also introduced the
BGA flip chip packaging that is suitable for small size ASB1 processor
systems.
AMD released the Embedded G-Series APU
platform in 2011, and launched the Embedded R-Series APU platform that
focuses on high-end graphic performance in 2012. In 2013, AMD will
launch embedded applications that are integrated with high-performance
graphics and computing performances as well as the SoC silicon chip
program that can connect a wide range of I/O peripherals together as
one.
AMD will continue to provide product supply,
open-source operating system support, drivers, software libraries,
development platforms, and technical support for its embedded market
products for 5 to 7 years. AMD will also provide diverse product
selection from the initial silicon circuit design stage to the
engineering sample stage, and will eventually link and intimately
collaborate with the existing industrial ecosystem.
Market is at a heterogeneous multicore emerging stage
Iyengar
used a three-stage CPU evolution schematic diagram to illustrate his
point. The single-core CPU has long since reached its development
bottleneck. The homogenous system would also reach the power, parallel
oriented software, and performance bottlenecks as the number of cores
has increased to a number that cannot continue to be sustained. The
heterogeneous system is at a burgeoning stage. The data parallel
mechanism enabled by energy efficient GPUs can ensure the continued
improvement of performance, although in extending performance, the
traditional programming models must be subverted and changed.
Iyengar
also mentioned the developmental history from the early single-core
microprocessors to the homogenous multi-core systems, and the advent of
the heterogeneous multi-core system. The AMD APU combines the serial
data processing of the traditional CPU with the parallel data processing
of the traditional AMD Radeon GPU into one. Products like the AMD
Embedded G-Series APU (G-T16R APU) have the average power consumption
rate of only 2.3W and an I/O controller chip that consumes less than 1W;
it is suitable for extremely small and convenient-to-carry embedded
mobile devices without a cooling fan. The AMD Embedded R-series APU
comprises the quad-core x86 core and the AMD Radeon 7000 GPU core with
384 parallel arithmetic units, which provide high performance that can
rival independent GPU graphics performance with DirectX 11 hardware
acceleration specifications and can use the OpenCL and DirectCompute
software to provide program solutions to enhance the performance of
embedded platform computing to another level.
Embedded product line and key technologies of AMD
The
AMD embedded product line is divided into different series. The
R-Series APU provides appropriate performance, energy efficiency, and
above high definition (HD) visual experiences. The G-Series APU
emphasizes low power consumption as well as unprecedented GPU
integration, and is suitable for mini and fanless system designs. In
addition, the AMD Radeon GPU provides amplified 3D and multimedia
performance specifically for embedded systems, and its product delivery
cycle is ensured for up to five years.
Iyengar
introduced the first key technology of the AMD APU, the AMD Turbo Core.
Taking the AMD R-464L as an example, the x86 core clocks at 2,300 MHz
and its GPU clocks at 496MHz. Under the general load balanced state of
the x86 core and its GPU, each clock remains unchanged. When the system
enters the multi-threaded parallel processing state, the clock of the
x86 core would dynamically increase by a maximum of 39% (up to 3,200
MHz), but the clock of the GPU remained unchanged. When implementing
programs that emphasize 3D graphic processing, the clock of the x86 core
remained at 2,300MHz, but the clock of its GPU would dynamically
increase by a maximum of 38% (685MHz). Depending on the needs of the
load, the APU can provide bidirectional and dynamic clock adjustments
for the GPU and the x86 core.
The other key technology
is the AMD Eyefinity technology. The AMD R-series APU can provide
external connections and has parallel display ports for four monitors.
When connected to an external PCIe add-on graphics card with six
DisplayPort (DP) v1.2 interfaces, the system can expand its access
capacityto up to ten monitors. The general embedded systems designs
based on the Intel CPU can only enable either the internal GPU or the
external Radeon GPU chip even with the additional add-on standalone GPU
chip. However, the AMD APU is equipped with AMD Dual Graphics technology
that enables the internal Radeon7000 GPU core to operate in parallel
with the external Radeon E6460/E6760 GPU chip to further compact and
enhance the 3D and multimedia graphics computing performance.
Iyengar
indicated that the AMD G- and R-series APUs can be applied to digital
billboards, casino gaming machines, IP-TVs, x86 set-top boxes, medical
applications, POS terminals and phone booth kiosks/automatic ticketing
systems, thin clients, video conferencing, human machine interfaces
(HMI), and industrial control applications, as well as communications
machines/infrastructures.
Unifying the industry to form
the heterogeneous system architecture (HSA) foundation for the
promotion of the parallel processing technology
Iyengar
stated that parallel computing can be applied to video and image
processing such as machine recognition, medical imaging, intelligent
billboards, and video surveillance; digital signal processing such as
telecommunications and national defense; network traffic packet
processing; and green high performance computer (HPC) applications. AMD
offers a full series of OpenCL-compatible heterogeneous parallel
processing application products ranging from the low power consumption
G-Series APU that is designed to consume only 4.5W to 18W of power with
80GFLOPs of maximum parallel computing performance to the
high-performance R-Series designed to consume 17W to 35W of power and
provide 500GFLOPs of parallel computing performance.
The
AMD Radeon GPU series, including the AMD Radeon E6460 GPU, adopts a BGA
package and the MXM module or the PCIe add-on card format, and is
designed with a power consumption rate of 20W in conjunction with the
25GB/s bandwidth GDDR5 memory in order to deliver its 192GFLOPs
floating-point performance. The E6760 GPU adopts a BGA package, the MXM
module, or the PCIe add-on card formats; and is designed with the power
consumption rate of 35W in conjunction with the 51GB/s bandwidth GDDR5
memory in order to deliver its 576GFLOPs floating-point performance. The
E6970GPU adopts the MXM module, and is designed with a power
consumption rate of 95W in conjunction with the 115GB/s bandwidth GDDR5
memory in order to deliver its 1.3 TFLOPs floating-point performance.
In
June 2012, AMD brought together ARM, Imagination, MediaTek, Texas
Instruments (TI), Samsung, and Qualcomm to form the nonprofit HSA
Foundation in order to establish a complete industrial chain from the
Silicon Intellectual Property (Silicon IP) to the software developers
and to promote the standardization of the heterogeneous system
architecture.
AMD has unified many of its industry
partners such as Sage Electronic Engineering, LLC.; ALT Software;
CORELIS; Core Avionics & Industrial, LLC.; Express Logic; ELTAN;
Green Hills Software; Texas Multicore Technologies, Inc. (TMT); Fluendo;
Viosoft; etc.; to cooperate in finding a solution that can ensure
prompt R&D and system integration for the OEM manufacturers. For
example, Gizmo, the AMD Embedded G-Series APU based small development
platform, has the circuit board area of only 4x4 inches and provides I/O
peripheral interfaces such as USB ports, 5.1 channel connectors, VGA
ports, PS/2 keyboard and mouse ports, and SATA ports. The Gizmo
development platform was originally developed under collaboration by
AMD, Sage, Viosoft, and Texas Multicore; provides Windows, Linux, and
RTOS operating system and associated drivers; and its back-end software
and technical support is provided by the nonprofit technology community
GizmoSphere. MORE
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